Now, I made the repaste using AS Mx-4 and thermal grizzly pads (for the VRM part) and play half a day with XTU to find out the best solution against clock/undervoltage, but for me is still a not satisfactory situation. I would had pay 50$ more with no problem at all to have this kind of solution instead of the original messy one. You don't need to be a 10 years experienced engineer to see that with a 2-3mm of extra tickness in the copper plate, a good mirror-finished contact suface and a good thermal paste (not alike the original hardened toothpaste) there will be at least 20°c of difference in heavy workload temperature. And not for a project lack, but just because the heatsink is CHEAP. Now the 'bad' part: thermal is simply inadequate for this kind of rig. No problem putting in place the upgrades: 4x16gb HyperX 2666 cl15 (a bargin at 280$ for 64gb on Amazon WD), 2Tb 970 Evo Plus in place of the original Micron nvme 256Gb (meh). Some parts could be a little more sturdy, but overall is a good layout (not as good as the HP, for example, that is totally tool-free in the bottom-cover part). In 20 minutes (the first time) I got heatsink off (using service manual). Service side: its quite easy to have access to all the parts of the notebook. The FHD ips screen is also quite good at first look, I don't alredy use it under direct sun light but it seems bright enough with good color deep and contrast. It seems what it should: a workstation level notebook. The materials, general build quality and the looks are Ok.
Ok, finally on tuesday I got my new 7740 with i9 9980HK and no discrete graphics (some days before the expeted 27/08 delivery date, some points more for Dell).
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